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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12148805 B1

PDFFull Text
Date of Patent:
Nov. 19, 2024

Filed:

Aug. 09, 2023

Semiconductor structure with wraparound backside amorphous layer

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shih-Chuan Chiu, Hsinchu, TW;

Huan-Chieh Su, Tianzhong Township, TW;

Pei-Yu Wang, Hsinchu, TW;

Cheng-Chi Chuang, New Taipei, TW;

Chun-Yuan Chen, Hsinchu, TW;

Li-Zhen Yu, New Taipei, TW;

Chia-Hao Chang, Hsinchu, TW;

Yu-Ming Lin, Hsinchu, TW;

Chih-Hao Wang, Baoshan Township, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

POLEY & LARDNER LLP

Primary Examiner:

Tong-Ho Kim

Int. Cl.
CPC ...
H01L 29/417 (2006.01); H01L 29/06 (2006.01); H01L 29/26 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/41733 (2013.01); H01L 29/0665 (2013.01); H01L 29/263 (2013.01); H01L 29/401 (2013.01); H01L 29/41775 (2013.01); H01L 29/42392 (2013.01); H01L 29/78696 (2013.01);
Abstract

A semiconductor structure includes an epitaxial region having a front side and a backside. The semiconductor structure includes an amorphous layer formed over the backside of the epitaxial region, wherein the amorphous layer includes silicon. The semiconductor structure includes a first silicide layer formed over the amorphous layer. The semiconductor structure includes a first metal contact formed over the first silicide layer.

Find Patent Forward Citations

Chiu, Shih-Chuan. (2024). Semiconductor structure with wraparound backside amorphous layer (U.S. Patent No. 12148805). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12148805

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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