logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12142510 B1

PDFFull Text
Date of Patent:
Nov. 12, 2024

Filed:

Dec. 23, 2020

Carrier for microelectronic assemblies having direct bonding

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Shawna M. Liff, Scottsdale, AZ (US);

Johanna M. Swan, Scottsdale, AZ (US);

Adel A. Elsherbini, Tempe, AZ (US);

Michael J. Baker, Gilbert, AZ (US);

Aleksandar Aleksov, Chandler, AZ (US);

Feras Eid, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Akona IP PC

Primary Examiner:

Kevin J Comber

Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/67092 (2013.01); H01L 24/75 (2013.01); H01L 2224/75983 (2013.01); H01L 2224/75985 (2013.01);
Abstract

Described herein are carrier assemblies, and related devices and methods. In some embodiments, a carrier assembly includes a carrier; a textured material including texturized microstructures coupled to the carrier; and microelectronic components mechanically coupled to the texturized microstructures. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; an electrode on the front side of the carrier; a dielectric material on the electrode; a charging contact on the back side coupled to the electrode; and microelectronic components electrostatically coupled to the front side of the carrier. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; electrodes on the front side; a dielectric material including texturized microstructures on the electrodes; charging contacts on the back side coupled to the plurality of electrodes; and microelectronic components mechanically and electrostatically coupled to the front side of the carrier.

Find Patent Forward Citations

Liff, Shawna. (2024). Carrier for microelectronic assemblies having direct bonding (U.S. Patent No. 12142510). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12142510

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…