The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Sep. 30, 2021
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Kui Zhang, Hefei, CN;

Xin Li, Hefei, CN;

Zhan Ying, Hefei, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 21/02 (2006.01); H01L 21/8238 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0922 (2013.01); H01L 21/0259 (2013.01); H01L 21/823807 (2013.01); H01L 21/823878 (2013.01); H01L 29/0665 (2013.01); H01L 29/42392 (2013.01); H01L 29/66742 (2013.01); H01L 29/78696 (2013.01);
Abstract

A semiconductor structure includes a base and conductive channel structure which includes first and second conductive channel layers and conductive buffer layer. The first conductive channel layer includes a first conductive channel, first and second doped regions on both sides of the first conductive channel; the second conductive channel layer includes a second conductive channel and third and fourth doped regions on both sides of the second conductive channel; the conductive buffer layer reduces electrical interference between the first and third doped regions. The semiconductor structure further includes a first wire layer disposed on the base extending in a direction and in contact with the second doped region; a second wire layer extending in another direction and in contact with the first and third doped regions; and a gate structure disposed around the first and second conductive channels.


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