The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Mar. 08, 2023
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Kuo-Hsing Lee, Hsinchu County, TW;

Sheng-Yuan Hsueh, Tainan, TW;

Chien-Liang Wu, Tainan, TW;

Te-Wei Yeh, Kaohsiung, TW;

Yi-Chun Chen, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 21/306 (2006.01); H01L 21/765 (2006.01); H01L 21/8252 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0605 (2013.01); H01L 21/30621 (2013.01); H01L 21/765 (2013.01); H01L 21/8252 (2013.01); H01L 27/0629 (2013.01); H01L 28/20 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/402 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01);
Abstract

A resistor with GaN structures, including a GaN layer with a 2DEG resistor region and an undoped polysilicon resistor region, an AlGaN barrier layer on the GaN layer in the 2DEG resistor region, multiple p-type doped GaN capping layers arranged on the AlGaN barrier layer so that the GaN layer not covered by the p-type doped GaN capping layers in the 2DEG resistor region is converted into a 2DEG resistor, a passivation layer on the GaN layer, and an undoped polysilicon layer on the passivation layer in the undoped polysilicon resistor region and functions as an undoped polysilicon resistor.


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