The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Dec. 12, 2022
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Meng-Hung Shen, Hsinchu County, TW;
Chih-Liang Chen, Hsinchu, TW;
Charles Chew-Yuen Young, Cupertino, CA (US);
Jiann-Tyng Tzeng, Hsinchu, TW;
Kam-Tou Sio, Hsinchu County, TW;
Wei-Cheng Lin, Taichung, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 27/088 (2006.01); H01L 27/092 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 49/02 (2006.01); H01L 27/02 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/762 (2013.01); H01L 21/76877 (2013.01); H01L 21/76895 (2013.01); H01L 23/5226 (2013.01); H01L 27/0886 (2013.01); H01L 27/0924 (2013.01); H01L 28/00 (2013.01); H01L 29/42356 (2013.01); H01L 29/66795 (2013.01); H01L 23/5283 (2013.01); H01L 27/0207 (2013.01); H01L 29/785 (2013.01); H01L 2924/01029 (2013.01);
Abstract
A method includes: disposing a first conductive segment; disposing a first conductive via above the first conductive segment; disposing a first conductive line above the first conductive via; and disposing a second conductive segment electrically coupled to the first conductive line through a third conductive segment, the first conductive segment, and the first conductive via.