The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Jul. 15, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chen-Hua Yu, Hsinchu, TW;

Hsing-Kuo Hsia, Jhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/30 (2006.01); G02B 6/42 (2006.01); H04B 10/80 (2013.01); H04Q 11/00 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12004 (2013.01); G02B 6/30 (2013.01); G02B 6/4206 (2013.01); G02B 6/4214 (2013.01); G02B 6/4274 (2013.01); G02B 6/428 (2013.01); H04B 10/801 (2013.01); H04B 10/807 (2013.01); H04Q 11/0005 (2013.01); H04Q 2011/0035 (2013.01);
Abstract

A device includes a photonic routing structure including a silicon waveguide, photonic devices, and a grating coupler, wherein the silicon waveguide is optically coupled to the photonic devices and to the grating coupler; an interconnect structure on the photonic routing structure, wherein the grating coupler is configured to optically couple to an external optical fiber disposed over the interconnect structure; and computing sites on the interconnect structure, wherein each computing site includes an electronic die bonded to the interconnect structure, wherein each electronic die of the computing sites is electrically connected to a corresponding photonic device of the photonic devices.


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