The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Apr. 03, 2024
Guangdong University of Technology, Guangdong, CN;
Jiabin Lu, Guangdong, CN;
Da Hu, Guangdong, CN;
Haotian Long, Guangdong, CN;
Yuhang Jin, Guangdong, CN;
Qiang Xiong, Guangdong, CN;
Guangdong University of Technology, Guangzhou, CN;
Abstract
Disclosed is a magnetorheological-elastomer (MRE) polishing pad suitable for chemical mechanical polishing (CMP) of a semiconductor wafer, which simultaneously realizes high-efficiency magnetic control polishing and high-efficiency Fenton reaction, forms an organosilicon-polyurethane matrix through an organosilicon-modified polyurethane prepolymer, and combines the characteristics of high flexibility and excellent comprehensive mechanical properties of organosilicon. CIP@FeOcomposite magnetic particles in the polishing pad can make the MRE polishing pad exhibit a high magnetorheological effect, and the produced ·OH can oxidize a surface of the semiconductor wafer to generate an oxide layer, reducing the material removal difficulty of abrasive materials and the polishing pad under the mechanical action.