The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Sep. 17, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ruilong Xie, Niskayuna, NY (US);

Reinaldo Vega, Mahopac, NY (US);

Alexander Reznicek, Troy, NY (US);

Kangguo Cheng, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/775 (2006.01); H01L 21/8234 (2006.01); H01L 23/538 (2006.01); H01L 27/092 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/092 (2013.01); H01L 21/823431 (2013.01); H01L 23/5386 (2013.01); H01L 27/1218 (2013.01); H01L 27/127 (2013.01);
Abstract

An integrated circuit component includes a first layer including first and second areas of epitaxy material. The first layer has a first polarity. The component further includes a second layer including third and fourth areas of epitaxy material. The second layer has a second polarity that is different than the first polarity. The third area is arranged at least partially above the first area, and the fourth area is arranged at least partially above the second area. The integrated circuit component further includes an interconnect in direct contact with one of the first area and the third area and in direct contact with one of the second area and the fourth area. The interconnect has a top surface that does not extend substantially above an uppermost surface of the second layer.


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