The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Apr. 22, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Sarath Babu, Singapore, SG;

Ananthkrishna Jupudi, Singapore, SG;

Yueh Sheng Ow, Singapore, SG;

Junqi Wei, Singapore, SG;

Kelvin Tai Ming Boh, Singapore, SG;

Kang Zhang, Singapore, SG;

Yuichi Wada, Chiba, JP;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32495 (2013.01); H01J 37/3244 (2013.01); H01J 37/32513 (2013.01); H01J 37/32642 (2013.01); H01J 37/32651 (2013.01);
Abstract

Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber, includes: a top plate having a central recess disposed in an upper surface thereof; a channel extending from an outer portion of the top plate to the central recess; a plurality of holes disposed through the top plate from a bottom surface of the recess to a lower surface of the top plate; a cover plate configured to be coupled to the top plate and to form a seal along a periphery of the central recess such that the covered recess forms a plenum within the top plate; and a tubular body extending down from the lower surface of the top plate and surrounding the plurality of holes, the tubular body further configured to surround a substrate support.


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