The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Apr. 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Mill-Jer Wang, Hsinchu, TW;
Tang-Jung Chiu, Hsinchu, TW;
Chi-Chang Lai, Taichung, TW;
Chia-Heng Tsai, New Taipei, TW;
Mirng-Ji Lii, Sinpu Township, Hsinchu County, TW;
Weil Liao, New Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and multiple first conductive lines over the semiconductor substrate. The first conductive lines are not electrically connected to each other. The semiconductor device structure also includes multiple first magnetic structures wrapped around portions of the first conductive lines and multiple second conductive lines over the semiconductor substrate. The second conductive lines are electrically connected in series. The semiconductor device structure further includes multiple second magnetic structures wrapped around portions of the second conductive lines. A size of each of the second magnetic structures and a size of each of the first magnetic structures are substantially the same.