The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Oct. 19, 2020
Applied Materials, Inc., Santa Clara, CA (US);
Jian Li, Fremont, CA (US);
Dmitry A. Dzilno, Sunnyvale, CA (US);
Juan Carlos Rocha-Alvarez, San Carlos, CA (US);
Paul L. Brillhart, Pleasanton, CA (US);
Akshay Gunaji, Bangalore, IN;
Mayur Govind Kulkarni, Bangalore, IN;
Sandeep Bindgi, Karnataka, IN;
Sanjay Kamath, Fremont, CA (US);
Kwangduk Douglas Lee, Redwood City, CA (US);
Zongbin Wang, Singapore, SG;
Yubin Zhang, Singapore, SG;
Yong Xiang Lim, Singapore, SG;
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Exemplary semiconductor processing systems include a processing chamber, a power supply, and a chuck disposed at least partially within the processing chamber. The chuck includes a chuck body defining a vacuum port. The chuck also includes first and second coplanar electrodes embedded in the chuck body and connected to the power supply. In some examples, coplanar electrodes include concentric electrodes defining a concentric gap in between. Exemplary semiconductor processing methods may include activating the power supply for the electrostatic chuck to secure a semiconductor substrate on the body of the chuck and/or activating the vacuum port defined by the body of the electrostatic chuck. Some processing can be carried out at increased pressure, while other processing can be carried out at reduced pressure with increased chucking voltage.