The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Jan. 19, 2022
Applicant:

Fei Company, Hillsboro, OR (US);

Inventors:

James Clarke, Austin, TX (US);

Micah LeDoux, Beaverton, OR (US);

Jason Lee Monfort, Portland, OR (US);

Brett Avedisian, St. Helens, OR (US);

Assignee:

FEI Company, Hillsboro, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 1/32 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); H01J 37/305 (2006.01); H01L 21/3213 (2006.01); H01L 21/67 (2006.01); H10B 41/27 (2023.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H01L 21/32131 (2013.01); G01N 1/32 (2013.01); G11C 5/025 (2013.01); G11C 5/06 (2013.01); H01J 37/3056 (2013.01); H01L 21/67069 (2013.01); H10B 41/27 (2023.02); H10B 43/27 (2023.02);
Abstract

Apparatus and methods are disclosed for sample preparation, suitable for online or offline use with multilayer samples. Ion beam technology is leveraged to provide rapid, accurate delayering with etch stops at a succession of target layers. In one aspect, a trench is milled around a region of interest (ROI), and a conductive coating is developed on an inner sidewall. Thereby, reliable conducting paths are formed between intermediate layers within the ROI and a base layer, and stray current paths extending outside the ROI are eliminated, providing better quality etch progress monitoring, during subsequent etching, from body or scattered currents. Ion beam assisted gas etching provides rapid delayering with etch stops at target polysilicon layers. Uniform etching at deep layers can be achieved. Variations and results are disclosed.


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