The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Apr. 22, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Yaoling Pan, San Jose, CA (US);

Patrick John Tae, Sunnyvale, CA (US);

Michael D. Willwerth, Campbell, CA (US);

Leonard M. Tedeschi, San Jose, CA (US);

Daniel Sang Byun, Campbell, CA (US);

Philip Allan Kraus, San Jose, CA (US);

Phillip A. Criminale, Livermore, CA (US);

Changhun Lee, San Jose, CA (US);

Rajinder Dhindsa, Pleasanton, CA (US);

Andreas Schmid, Meyriez, CH;

Denis M. Koosau, Pleasanton, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01J 37/32 (2006.01); H01L 21/66 (2006.01); H03K 17/955 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67259 (2013.01); H01J 37/32477 (2013.01); H01J 37/3288 (2013.01); H01L 22/12 (2013.01); H03K 17/955 (2013.01); H01J 2237/022 (2013.01);
Abstract

The present disclosure generally relates to a method and apparatus for determining a metric related to erosion of a ring assembly used in an etching within a plasma processing chamber. In one example, the apparatus is configured to obtain a metric indicative of erosion on an edge ring disposed on a substrate support assembly in a plasma processing chamber. A sensor obtains the metric for the edge ring. The metric correlates to the quantity of erosion in the edge ring. In another example, the ring sensor may be arranged outside of a periphery of a substrate support assembly. The metric may be acquired by the ring sensor through a plasma screen.


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