The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Sep. 29, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Joshua Hooge, Austin, TX (US);

Michael Carcasi, Austin, TX (US);

Mark Somervell, Hillsboro, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 11/10 (2006.01); B05C 5/02 (2006.01); B05C 13/02 (2006.01); B05D 1/00 (2006.01); B05D 1/26 (2006.01); G05D 7/06 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B05D 1/005 (2013.01); B05C 5/0225 (2013.01); B05C 11/1013 (2013.01); B05C 11/1023 (2013.01); B05C 13/02 (2013.01); B05D 1/26 (2013.01); G05D 7/0641 (2013.01); H01L 21/67017 (2013.01); H01L 21/67051 (2013.01); H01L 21/67253 (2013.01);
Abstract

Embodiments are described herein to monitor and synchronize dispense systems for processing systems. For one embodiment, pressure and flow rate sensors are used to determine a delay between a flow change event and an increase in flow rate, and this delay is used to detect defects or conditions within the dispense system. For one embodiment, dispense system operation is synchronized using flow rate sensors. For one embodiment, simulation models or complex dispense profiles based upon combined pressure/flow/spin/concentration sensor data are used to enable complex process recipes. For one embodiment, dispense-to-dispense pressure and/or flow rate measurements are used to detect dispense parameters and defects. For one embodiment, cameras and image processing are used to detect flow rates from the dispense nozzle, and dispense-to-dispense measurements are used to detect dispense parameters and defects. One or more of the disclosed embodiments can be used in processing systems for microelectronic workpieces.


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