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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11990383 B1

PDFFull Text
Date of Patent:
May. 21, 2024

Filed:

Nov. 02, 2022

Package structure having at least one die with a plurality of taper-shaped die connectors

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hung-Jui Kuo, Hsinchu, TW;

Hui-Jung Tsai, Hsinchu, TW;

Tai-Min Chang, Taipei, TW;

Chia-Wei Wang, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Khiem D Nguyen

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/561 (2013.01); H01L 23/5384 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05099 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16145 (2013.01); H01L 2924/181 (2013.01);
Abstract

A conductive structure, includes: a plurality of conductive layers; a plurality of conductive pillars being formed on the plurality of conductive layers, respectively; and a molding compound laterally coating the plurality of conductive pillars. Each of the plurality of conductive pillars is a taper-shaped conductive pillar, and is tapered from the conductive layers.

Find Patent Forward Citations

Kuo, Hung-Jui. (2024). Package structure having at least one die with a plurality of taper-shaped die connectors (U.S. Patent No. 11990383). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11990383

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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