The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Jan. 05, 2023
Applicant:
Adeia Semiconductor Solutions Llc, San Jose, CA (US);
Inventors:
Benjamin David Briggs, Waterford, NY (US);
Lawrence A. Clevenger, Rhinebeck, NY (US);
Bartlet H. Deprospo, Goshen, NY (US);
Huai Huang, Saratoga, NY (US);
Christopher J. Penny, Saratoga Springs, NY (US);
Michael Rizzolo, Albany, NY (US);
Assignee:
Adeia Semiconductor Solutions LLC, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76802 (2013.01); H01L 21/76819 (2013.01); H01L 21/7682 (2013.01); H01L 21/76829 (2013.01); H01L 21/76834 (2013.01); H01L 21/7684 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 23/53219 (2013.01); H01L 23/53223 (2013.01); H01L 23/53233 (2013.01); H01L 23/53238 (2013.01); H01L 23/5329 (2013.01); H01L 21/76825 (2013.01); H01L 21/76828 (2013.01); H01L 21/76832 (2013.01); H01L 21/76883 (2013.01); H01L 23/53252 (2013.01); H01L 2221/1047 (2013.01);
Abstract
A semiconductor device includes a porous dielectric layer including a recessed portion, a conductive layer formed in the recessed portion, and a cap layer formed on the porous dielectric layer and on the conductive layer in the recessed portion, an upper surface of the porous dielectric layer being exposed through a gap in the cap layer.