The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

Mar. 12, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Yongkwan Kim, Fremont, CA (US);

Changhun Lee, San Jose, CA (US);

Kyeong-Tae Lee, Livermore, CA (US);

Chung Hoan Kim, San Jose, CA (US);

Youngmin Shin, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/40 (2006.01); G03F 7/42 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32357 (2013.01); C23C 16/402 (2013.01); G03F 7/427 (2013.01); H01J 37/32724 (2013.01); H01J 37/32733 (2013.01); H01J 37/32899 (2013.01); H01J 2237/338 (2013.01);
Abstract

A method for recovering ashing rate in a plasma processing chamber includes positioning a substrate in a processing volume of a processing chamber, wherein the substrate has a silicon chloride residue formed thereon. The method further includes evaporating the silicon chloride residue from the substrate. The method further includes depositing the evaporated silicon chloride on one or more interior surfaces in the processing volume. The method further includes exposing the deposited silicon chloride to an oxidizing environment to convert the deposited silicon chloride to a silicon oxide passivation layer. The oxidizing environment can comprise an oxygen-containing plasma, oxygen radicals, or a combination thereof.


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