The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Feb. 12, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Jeremy Ecton, Gilbert, AZ (US);
Oscar Ojeda, Chandler, AZ (US);
Leonel Arana, Phoenix, AZ (US);
Suddhasattwa Nad, Chandler, AZ (US);
Robert May, Chandler, AZ (US);
Hiroki Tanaka, Chandler, AZ (US);
Brandon C. Marin, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/283 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/283 (2013.01); H05K 1/0296 (2013.01); H05K 3/061 (2013.01);
Abstract
Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a substrate and a conductive feature over the substrate. In an embodiment, a metallic mask is positioned over the conductive feature. In an embodiment, the metallic mask extends beyond a first edge of the conductive feature and a second edge of the conductive feature.