The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Jun. 23, 2021
Applicant:

Nexgen Power Systems, Inc., Santa Clara, CA (US);

Inventors:

Wayne Chen, Santa Clara, CA (US);

Andrew P. Edwards, Santa Clara, CA (US);

Clifford Drowley, Santa Clara, CA (US);

Subhash Srinivas Pidaparthi, Santa Clara, CA (US);

Assignee:

Nexgen Power Systems, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/20 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 21/66 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30612 (2013.01); H01L 21/308 (2013.01); H01L 22/26 (2013.01); H01L 29/2003 (2013.01); H01L 29/66522 (2013.01); H01L 29/66666 (2013.01); H01L 29/7827 (2013.01);
Abstract

A method of manufacturing a vertical FET device includes providing a semiconductor substrate structure including a marker layer; forming a hardmask layer coupled to the semiconductor substrate structure, wherein the hardmask layer comprises a set of openings operable to expose an upper surface portion of the semiconductor substrate structure; etching the upper surface portion of the semiconductor substrate structure to form a plurality of fins; etching at least a portion of the marker layer; detecting the etching of the at least a portion of the marker layer; epitaxially growing a semiconductor layer in recess regions disposed between adjacent fins of the plurality of fins; forming a source metal layer on each of the plurality of fins; and forming a gate metal layer coupled to the semiconductor layer.


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