The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Feb. 25, 2022
Applied Materials, Inc., Santa Clara, CA (US);
Eric Lau, Santa Clara, CA (US);
Charles C. Garretson, Monterey, CA (US);
Huanbo Zhang, San Jose, CA (US);
Zhize Zhu, Cupertino, CA (US);
Benjamin Cherian, San Jose, CA (US);
Brian J. Brown, Palo Alto, CA (US);
Thomas H. Osterheld, Mountain View, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Generating a recipe for controlling a polishing system includes receiving a target removal profile that includes a target thickness to remove for a plurality of locations on a substrate that are angularly distributed around the substrate, and storing a first function defining a polishing rate for a zone from a plurality of pressurizable zones of a carrier head that are angularly distributed around a the carrier head. The first function defines polishing rates as a function of pressures. For each particular zone of the plurality of zones a recipe defining a pressure for the particular zone over time is calculated by calculating an expected thickness profile after polishing using the first function, and minimizing a cost function that incorporates a first term representing a difference between the expected thickness profile and a target thickness profile.