The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Jul. 21, 2021
Applicant:

Applied Materials Israel Ltd., Rehovot, IL;

Inventors:

Michael Chemama, Rehovot, IL;

Ron Meiry, Givatayim, IL;

Moshe Eliasof, Givatayim, IL;

Lior Yaron, Nes Ziona, IL;

Guy Eytan, Kidron, IL;

Konstantin Chirko, Rehovot, IL;

Rafael Bistritzer, Petach Tikva, IL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 23/2206 (2018.01); G01N 23/2251 (2018.01); H01J 37/22 (2006.01); H01J 37/28 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01N 23/2206 (2013.01); G01N 23/2251 (2013.01); H01J 37/222 (2013.01); H01J 37/28 (2013.01); H01L 22/20 (2013.01); G01N 2223/053 (2013.01); G01N 2223/303 (2013.01); G01N 2223/306 (2013.01); G01N 2223/401 (2013.01); G01N 2223/418 (2013.01); G01N 2223/501 (2013.01); G01N 2223/61 (2013.01); G01N 2223/6116 (2013.01); G01N 2223/66 (2013.01); H01J 2237/2802 (2013.01); H01J 2237/2806 (2013.01); H01J 2237/2815 (2013.01);
Abstract

There is provided a system and method of measuring a lateral recess in a semiconductor specimen, comprising: obtaining a first image acquired by collecting SEs emitted from the surface of the specimen, and a second image acquired by collecting BSEs scattered from an interior region of the specimen between the surface and a target second layer, the specimen scanned using an electron beam with a landing energy selected to penetrate to a depth corresponding to the target second layer; generating a first GL waveform based on the first image, and a second GL waveform based on the second image; estimating a first width of the first layers based on the first GL waveform, and a second width with respect to at least the target second layer based on the second GL; and measuring a lateral recess based on the first width and the second width.


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