The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Oct. 01, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Byung Yoon Kim, Boise, ID (US);

Sheng Wei Yang, Boise, ID (US);

Si-Woo Lee, Boise, ID (US);

Mark Zaleski, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H10B 12/00 (2023.01); H01L 27/06 (2006.01); G11C 5/02 (2006.01); G11C 5/10 (2006.01);
U.S. Cl.
CPC ...
H10B 12/30 (2023.02); G11C 5/025 (2013.01); G11C 5/10 (2013.01); H01L 27/0688 (2013.01); H10B 12/02 (2023.02);
Abstract

Systems, methods, and apparatus including conductive line contact regions having multiple multi-direction conductive lines and staircase conductive line contact structures for semiconductor devices. One memory device comprises arrays of vertically stacked memory cells, having multiple multi-direction conductive lines arrays of vertically stacked memory cells, including a vertical stack of layers formed from repeating iterations of a group of layers, the group of layers comprising: a first dielectric material layer, a semiconductor material layer, and a second dielectric material layer, the second dielectric material layer having a conductive line formed in a horizontal plane therein, and the vertical stack of layers having multiple multi-direction conductive lines in an interconnection region with a first portion of the interconnection region formed in an array region and a second portion formed in a conductive line contact region that is spaced from the array region.


Find Patent Forward Citations

Loading…