The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
May. 29, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Wilfred Gomes, Portland, OR (US);
Mauro J. Kobrinsky, Portland, OR (US);
Doug B. Ingerly, Portland, OR (US);
Tahir Ghani, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01Q 1/24 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 24/16 (2013.01); H01L 2224/16145 (2013.01); H01L 2924/1436 (2013.01); H01Q 1/24 (2013.01);
Abstract
Embodiments may relate to a microelectronic package. The microelectronic package may include a memory die with: a first memory cell at a first layer of the memory die; a second memory cell at a second layer of the memory die; and a via in the memory die that communicatively couples an active die with a package substrate of the microelectronic package. Other embodiments may be described or claimed.