The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Feb. 25, 2021
Tokyo Electron Limited, Tokyo, JP;
David Hurley, Dublin, IE;
Ioan Domsa, Dublin, IE;
Ian Colgan, Dublin, IE;
Gerhardus Van Der Linde, Dublin, IE;
Patrick Hughes, Dublin, IE;
Maciej Burel, Dublin, IE;
Barry Clarke, Dublin, IE;
Mihaela Ioana Popovici, Leuven, BE;
Lars-Ake Ragnarsson, Leuven, BE;
Gerrit J. Leusink, Albany, NY (US);
Robert Clark, Fremont, CA (US);
Dina Triyoso, Albany, NY (US);
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
A system for processing semiconductor wafers, the system including: a processing chamber; a heat source; a substrate holder configured to expose a semiconductor wafer to the heat source; a first electrode configured to be detachably coupled to a first major surface of a semiconductor wafer; and a second electrode coupled to the substrate holder, the first electrode and the second electrode together configured to apply an electric field in the semiconductor wafer.