The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Mar. 24, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Katie Lutker-Lee, Albany, NY (US);

Angelique Raley, Albany, NY (US);

Dina Triyoso, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01); H10N 70/00 (2023.01); H10B 63/00 (2023.01);
U.S. Cl.
CPC ...
H10N 70/8833 (2023.02); H10B 63/80 (2023.02); H10N 70/021 (2023.02); H10N 70/063 (2023.02); H10N 70/068 (2023.02); H10N 70/841 (2023.02);
Abstract

Methods are provided herein for improving oxygen content control in a Metal-Insulator-Metal (MIM) stack of an RERAM cell, while also maintaining throughput. More specifically, a single chamber solution is provided herein for etching and encapsulating the MIM stack of an RERAM cell to control the oxygen content in the memory cell dielectric of the RERAM cell. According to one embodiment, a non-oxygen-containing dielectric encapsulation layer is deposited onto the MIM stack in-situ while the substrate remains within the processing chamber used to etch the MIM stack. By etching the MIM stack and depositing the encapsulation layer within the same processing chamber, the techniques described herein minimize the exposure of the memory cell dielectric to oxygen, while maintaining throughput.


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