The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Jun. 24, 2022
Applicant:

Panasonic Holdings Corporation, Osaka, JP;

Inventors:

Yusuke Mori, Osaka, JP;

Masashi Yoshimura, Osaka, JP;

Masayuki Imanishi, Osaka, JP;

Shigeyoshi Usami, Osaka, JP;

Junichi Takino, Osaka, JP;

Masayuki Hoteida, Osaka, JP;

Shunichi Matsuno, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 35/00 (2006.01); C30B 25/16 (2006.01); C30B 29/40 (2006.01); C23C 16/455 (2006.01); C23C 16/30 (2006.01); C30B 25/14 (2006.01);
U.S. Cl.
CPC ...
C30B 25/165 (2013.01); C23C 16/303 (2013.01); C23C 16/45561 (2013.01); C30B 25/14 (2013.01); C30B 29/406 (2013.01); C30B 35/00 (2013.01);
Abstract

A manufacturing apparatus for a group-III nitride crystal, the manufacturing apparatus includes: a raw material chamber that produces therein a group-III element oxide gas; and a nurturing chamber in which a group-III element oxide gas supplied from the raw material chamber and a nitrogen element-containing gas react therein to produce a group-III nitride crystal on a seed substrate, wherein an angle that is formed by a direction along a shortest distance between a forward end of a group-III element oxide gas supply inlet to supply the group-III element oxide gas into the nurturing chamber and an outer circumference of the seed substrate placed in the nurturing chamber, and a surface of the seed substrate is denoted by 'θ', wherein a diameter of the group-Ill element oxide gas supply inlet is denoted by “S”, wherein a distance between a surface, on which the seed substrate is placed, of a substrate susceptor that holds the seed substrate and a forward end of a first carrier gas supply inlet to supply a first carrier gas into the nurturing chamber is denoted by “L”, wherein a distance between the forward end of the first carrier gas supply inlet and the forward end of the group-III element oxide gas supply inlet is denoted by “M”, wherein a diameter of the seed substrate is denoted by “k”, and wherein following Eqs. (1) to (4), 0°<θ<90° (1), 0.21≤S/k≤0.35 (2), 1.17≤(L+M)/k≤1.55 (3), k=2*(L+M)/tan θ+S (4) are satisfied.


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