The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
May. 09, 2022
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Hsi-Wen Tien, Hsinchu County, TW;
Wei-Hao Liao, Taichung, TW;
Pin-Ren Dai, Hsinchu County, TW;
Chih-Wei Lu, Hsinchu, TW;
Chung-Ju Lee, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 50/10 (2023.01); G11C 11/16 (2006.01); H01L 23/522 (2006.01); H10B 61/00 (2023.01); H10N 50/01 (2023.01); H10N 50/80 (2023.01); H10N 50/85 (2023.01);
U.S. Cl.
CPC ...
H10N 50/10 (2023.02); G11C 11/161 (2013.01); H01L 23/5226 (2013.01); H10B 61/00 (2023.02); H10B 61/22 (2023.02); H10N 50/01 (2023.02); H10N 50/80 (2023.02); H10N 50/85 (2023.02);
Abstract
A device includes a semiconductor substrate, a bottom conductive line, a bottom electrode, a magnetic tunneling junction (MTJ), and a residue. The bottom conductive line is over the semiconductor substrate. The bottom electrode is over the bottom conductive line. The MTJ is over the bottom electrode. The residue of the MTJ is on the sidewall of the bottom electrode and is spaced apart from the bottom conductive line.