The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Nov. 30, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Ashonita A. Chavan, Boise, ID (US);

Durai Vishak Nirmal Ramaswamy, Boise, ID (US);

Manuj Nahar, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H10B 53/30 (2023.01); H01L 21/28 (2006.01); H10B 51/30 (2023.01); H01L 21/02 (2006.01); H01L 49/02 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H10B 53/30 (2023.02); H01L 21/02164 (2013.01); H01L 21/28088 (2013.01); H01L 21/28097 (2013.01); H01L 28/55 (2013.01); H01L 28/60 (2013.01); H01L 29/40111 (2019.08); H01L 29/4966 (2013.01); H01L 29/4975 (2013.01); H01L 29/516 (2013.01); H01L 29/517 (2013.01); H01L 29/6684 (2013.01); H01L 29/78391 (2014.09); H10B 51/30 (2023.02);
Abstract

A method used in forming an electronic component comprising conductive material and ferroelectric material comprises forming a non-ferroelectric metal oxide-comprising insulator material over a substrate. A composite stack comprising at least two different composition non-ferroelectric metal oxides is formed over the substrate. The composite stack has an overall conductivity of at least 1×10Siemens/cm. The composite stack is used to render the non-ferroelectric metal oxide-comprising insulator material to be ferroelectric. Conductive material is formed over the composite stack and the insulator material. Ferroelectric capacitors and ferroelectric field effect transistors independent of method of manufacture are also disclosed.


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