The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Apr. 23, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hirofumi Yamaguchi, Nirasaki, JP;

Yoshiaki Sasaki, Nirasaki, JP;

Yuichi Nishimori, Nirasaki, JP;

Atsushi Tanaka, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05B 1/02 (2006.01); H01L 21/677 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H05B 3/28 (2006.01);
U.S. Cl.
CPC ...
H05B 1/0233 (2013.01); H01L 21/6719 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/67161 (2013.01); H01L 21/67167 (2013.01); H01L 21/67196 (2013.01); H01L 21/67201 (2013.01); H01L 21/67207 (2013.01); H01L 21/67248 (2013.01); H01L 21/67706 (2013.01); H01L 21/67754 (2013.01); H01L 21/67781 (2013.01); H01L 21/68742 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01); H05B 3/283 (2013.01); H01L 21/67742 (2013.01);
Abstract

A substrate processing apparatus includes: a chamber having a container including at least one substrate-heating region and at least one substrate-cooling region; a heating mechanism configured to heat a first substrate in the at least one substrate-heating region; a cooling mechanism configured to cool a second substrate in the at least one substrate-cooling region while the first substrate is being heated; and a partition provided in the container and configured to separate the at least one substrate-heating region and the at least one substrate-cooling region from each other in terms of heat and pressure.


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