logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11855333 B1

PDFFull Text
Date of Patent:
Dec. 26, 2023

Filed:

Jul. 26, 2022

Semiconductor packages and manufacturing methods thereof

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yung-Ping Chiang, Hsinchu County, TW;

Chao-Wen Shih, Hsinchu County, TW;

Shou-Zen Chang, New Taipei, TW;

Albert Wan, Hsinchu, TW;

Yu-Sheng Hsieh, New Taipei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Jose R Diaz

Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/31 (2006.01); H01Q 21/06 (2006.01); H01Q 1/38 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 23/66 (2006.01); H01Q 9/04 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/768 (2013.01); H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/528 (2013.01); H01L 23/66 (2013.01); H01L 24/14 (2013.01); H01L 24/82 (2013.01); H01Q 1/38 (2013.01); H01Q 9/04 (2013.01); H01Q 21/065 (2013.01); H01L 21/568 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/18 (2013.01); H01L 2924/1431 (2013.01);
Abstract

Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.

Find Patent Forward Citations

Chiang, Yung-Ping. (2023). Semiconductor packages and manufacturing methods thereof (U.S. Patent No. 11855333). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11855333

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…