The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
May. 13, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Pu Wang, Hsinchu, TW;
Li-Hui Cheng, New Taipei, TW;
Szu-Wei Lu, Hsinchu, TW;
Hsien-Ju Tsou, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A method of fabricating an integrated fan-out package is provided. A ring-shaped dummy die and a group of integrated circuit dies are mounted over a carrier, wherein the group of integrated circuit dies are surrounded by the ring-shaped dummy die. The ring-shaped dummy die and the group of integrated circuit dies over the carrier are encapsulated with an insulating encapsulation. A redistribution circuit structure is formed on the ring-shaped dummy die, the group of integrated circuit dies and the insulating encapsulation, wherein the redistribution circuit structure is electrically connected to the group of integrated circuit dies, and the ring-shaped dummy die is electrically floating.