The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Mar. 22, 2022
Applicant:

Mpi Corporation, Chu-Pei, TW;

Inventors:

Yu-Shan Hu, Chu-Pei, TW;

Yi-Lung Lee, Chu-Pei, TW;

Shao-Lun Wei, Chu-Pei, TW;

Yu-Wen Chou, Chu-Pei, TW;

Assignee:

MPI CORPORATION, Chu-Pei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G01R 1/073 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0251 (2013.01); G01R 1/07342 (2013.01); H05K 1/115 (2013.01); H05K 1/118 (2013.01);
Abstract

A trace embedded probe device includes a circuit board including an insulating layer unit whose upper surface has first recesses and a second recess located therebetween, grounding traces and a signal trace whose trace main bodies are disposed in the recesses respectively and flush in elevation with the upper surface, and a grounding layer disposed on a lower surface of the insulating layer unit and connected with the grounding traces by conductive vias penetrating through the first recesses and the lower surface and provided therein with conductive layers. The trace main bodies, grounding layer and conductive layers are made of a same metal material. Probes are disposed on the grounding and signal traces respectively. The probe device is easy in control of distance, width, thickness and surface roughness of the traces, and beneficial to achieve the requirements of thin copper traces, fine pitch and high frequency testing.


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