The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Jan. 25, 2022
Applicant:

Adeia Semiconductor Technologies Llc, San Jose, CA (US);

Inventors:

Javier A. DeLaCruz, San Jose, CA (US);

Belgacem Haba, Saratoga, CA (US);

Rajesh Katkar, Milpitas, CA (US);

Assignee:

Invensas LLC, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); G06F 15/78 (2006.01); H01L 23/532 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); G06F 15/76 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G06F 15/7825 (2013.01); H01L 23/53204 (2013.01); H01L 24/08 (2013.01); H01L 24/83 (2013.01); H01L 25/18 (2013.01); G06F 2015/763 (2013.01); H01L 2224/08145 (2013.01); H01L 2225/06524 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01);
Abstract

The technology relates to a system on chip (SoC). The SoC may include a plurality of network layers which may assist electrical communications either horizontally or vertically among components from different device layers. In one embodiment, a system on chip (SoC) includes a plurality of network layers, each network layer including one or more routers, and more than one device layers, each of the plurality of network layers respectively bonded to one of the device layers. In another embodiment, a method for forming a system on chip (SoC) includes forming a plurality of network layers in an interconnect, wherein each network layer is bonded to an active surface of a respective device layer in a plurality of device layer.


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