The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

May. 18, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Wang-Hua Lin, Xiushui Township, Changhua County, TW;

Chun-Liang Tai, Hsinchu, TW;

Chun-Hsiang Fan, Hsinchu, TW;

Ming-Hsi Yeh, Hsinchu, TW;

Kuo-Bin Huang, Jhubei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/67 (2006.01); B08B 3/08 (2006.01); B08B 3/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68721 (2013.01); B08B 3/08 (2013.01); B08B 3/10 (2013.01); H01L 21/67051 (2013.01); H01L 21/67103 (2013.01); H01L 21/68728 (2013.01); H01L 21/68735 (2013.01); H01L 21/68742 (2013.01);
Abstract

A method for cleaning a semiconductor wafer is provided. The method includes placing a semiconductor wafer over a supporter arranged around a central axis of a spin base. The method further includes securing the semiconductor wafer using a clamping member positioned on the supporter. The movement of the semiconductor wafer during the placement of the semiconductor wafer over the supporter is guided by a guiding member located over the clamping member. The method also includes spinning the semiconductor wafer by rotating the spin base about the central axis. In addition, the method includes dispensing a processing liquid over the semiconductor wafer.


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