The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Jul. 01, 2021
Applicants:

Entegris, Inc., Billerica, MA (US);

University of Florida Research Foundation, Inc., Gainesville, FL (US);

Inventors:

Rajiv K. Singh, Newberry, FL (US);

Arul Arjunan, Gainesville, FL (US);

Deepika Singh, Newberry, FL (US);

Chaitanya Ginde, Gainesville, FL (US);

Puneet Jawali, Gainesville, FL (US);

Assignee:

ENTEGRIS, INC., Billerica, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/321 (2006.01); B24B 37/00 (2012.01); B24B 37/04 (2012.01); C09G 1/04 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/00 (2013.01); B24B 37/044 (2013.01); C09G 1/04 (2013.01); C09K 3/1409 (2013.01); H01L 21/02024 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01);
Abstract

A method of CMP includes providing a slurry solution including ≥1 per-compound oxidizer in a concentration between 0.01 M and 2 M with a pH from 2 to 5 or 8 to 11, and ≥1 buffering agent which provides a buffering ratio ≥1.5 that compares an amount of a strong acid needed to reduce the pH from 9.0 to 3.0 as compared to an amount of strong acid to change the pH from 9.0 to 3.0 without the buffering agent. The slurry solution is exclusive any hard slurry particles or has only soft slurry particles that have throughout a Vickers hardness <300 Kg/mmor Mohs Hardness <4. The slurry solution is dispensed on a hard surface having a Vickers hardness >1,000 kg/mmis pressed by a polishing pad with the slurry solution in between while rotating the polishing pad relative to the hard surface.


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