The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2023
Filed:
Apr. 19, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chen-Hsuan Tsai, Taitung, TW;
Tsung-Fu Tsai, Changhua, TW;
Shih-Ting Lin, Taipei, TW;
Szu-Wei Lu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A package structure is provided. The package structure includes a substrate and a stack of semiconductor dies over the substrate. The package structure also includes an underfill element covering sidewalls of the semiconductor dies. The package structure further includes a protective film attached to the substrate and laterally surrounding the underfill element and the semiconductor dies. The underfill element separates the protective film from the semiconductor dies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile