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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11815815 B1

PDFFull Text
Date of Patent:
Nov. 14, 2023

Filed:

Nov. 06, 2015

Composition for forming silicon-containing resist underlayer film removable by wet process

Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Hiroyuki Wakayama, Toyama, JP;

Makoto Nakajima, Toyama, JP;

Wataru Shibayama, Toyama, JP;

Masahisa Endo, Toyama, JP;

Assignee:

NISSAN CHEMICAL INDUSTRIES, LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Martin J Angebranndt

Int. Cl.
CPC ...
G03F 7/075 (2006.01); G03F 7/11 (2006.01); G03F 7/38 (2006.01); G03F 7/40 (2006.01); G03F 7/09 (2006.01); C09D 4/00 (2006.01); C09D 183/04 (2006.01); C09D 183/06 (2006.01); C09D 183/02 (2006.01); C08G 77/14 (2006.01); H01L 21/02 (2006.01); H01L 21/31 (2006.01); G03F 7/20 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0752 (2013.01); C09D 4/00 (2013.01); C09D 183/02 (2013.01); C09D 183/04 (2013.01); C09D 183/06 (2013.01); G03F 7/091 (2013.01); G03F 7/11 (2013.01); G03F 7/2004 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); H01L 21/02123 (2013.01); H01L 21/311 (2013.01); C08G 77/14 (2013.01);
Abstract

Provided is a resist underlayer film-forming composition for forming resist underlayer film usable as hard mask and removable by wet etching process using chemical solution such as sulfuric acid/hydrogen peroxide. A resist underlayer film-forming composition for lithography includes a component (A) and component (B), the component (A) includes a hydrolyzable silane, hydrolysis product thereof, or hydrolysis-condensation product thereof, the hydrolyzable silane includes hydrolyzable silane of Formula (1): RRSi(R)(where Ris organic group of Formula (2): and is bonded to silicon atom through a Si—C bond; Ris an alkoxy group, acyloxy group, or halogen group; is an integer of 1; b is an integer of 0 to 2; and a+b is an integer of 1 to 3), and the component (B) is cross-linkable compound having ring structure having alkoxymethyl group or hydroxymethyl group, cross-linkable compound having epoxy group or blocked isocyanate group.

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