The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2023

Filed:

May. 19, 2017
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Yuri Paskover, Caesarea, IL;

Amnon Manassen, Haifa, IL;

Vladimir Levinski, Migdal HaEmek, IL;

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G01N 21/64 (2006.01); G01N 21/95 (2006.01); G01B 11/27 (2006.01); G03F 7/00 (2006.01); G01B 11/30 (2006.01);
U.S. Cl.
CPC ...
G01B 11/272 (2013.01); G01B 11/303 (2013.01); G01N 21/6489 (2013.01); G01N 21/9501 (2013.01); G03F 7/70633 (2013.01); G01B 2210/56 (2013.01);
Abstract

Systems and methods are provided which utilize optical microcavity probes to map wafer topography by near-field interactions therebetween in a manner which complies with high volume metrology requirements. The optical microcavity probes detect features on a wafer by shifts in an interference signal between reference radiation and near-field interactions of radiation in the microcavities and wafer features, such as device features and metrology target features. Various illumination and detection configurations provide quick and sensitive signals which are used to enhance optical metrology measurements with respect to their accuracy and sensitivity. The optical microcavity probes may be scanned at a controlled height and position with respect to the wafer and provide information concerning the spatial relations between device and target features.


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