The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

Dec. 11, 2019
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Shay Reboh, Grenoble, FR;

Victor Boureau, Grenoble, FR;

Sylvain Maitrejean, Grenoble, FR;

Francois Andrieu, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/02 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3083 (2013.01); H01L 21/0245 (2013.01); H01L 21/02249 (2013.01); H01L 21/3081 (2013.01); H01L 21/8234 (2013.01);
Abstract

A method for producing a semiconductor substrate is provided, including: producing a superficial layer arranged on a buried dielectric layer and including a strained semiconductor region; producing an etching mask on the superficial layer, covering a part of the region; etching the superficial layer to a pattern of the mask, exposing a first lateral edge of a first strained semiconductor portion belonging to the part and contacting the dielectric layer; forming a mechanical barrier from a second portion of material belonging to the first portion, the second portion having a bottom surface contacting the dielectric layer and an upper surface contacting the mask, the barrier arranged against the part and bearing mechanically against the second portion, and removing the mask.


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