The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2023
Filed:
Sep. 14, 2021
Applicant:
Cmc Materials, Inc., Aurora, IL (US);
Inventors:
Brian Reiss, Woodridge, IL (US);
Fernando Hung Low, Naperville, IL (US);
Michael Morrow, New Lenox, IL (US);
Helin Huang, Aurora, IL (US);
Assignee:
CMC Materials, Inc., Aurora, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/3105 (2006.01); C09K 13/00 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 13/00 (2013.01); H01L 21/31053 (2013.01);
Abstract
The invention provides a chemical-mechanical polishing composition comprising: (a) a silica abrasive, (b) a surfactant, (c) an iron cation, (d) optionally a ligand, and (e) water, wherein the silica abrasive has a negative zeta potential in the chemical-mechanical polishing composition. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising a carbon-based film, using said composition.