The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Oct. 16, 2019
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Takashi Hiroi, Tokyo, JP;

Nobuaki Hirose, Tokyo, JP;

Takahiro Urano, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); G01N 21/88 (2006.01); G01N 21/956 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/8851 (2013.01); G01N 21/956 (2013.01); G06T 7/0006 (2013.01); G01N 2021/8887 (2013.01); G01N 2021/95676 (2013.01); G06T 2207/30148 (2013.01);
Abstract

The purpose of this invention is to make it possible to efficiently and accurately detect a reticle defect at an earlier stage in a manufacturing process. The inspection device according to this invention uses the results of comparing die images of wafers that have had patterns transferred thereto using the same reticle after subjecting the die images to averaging processing and the results of comparing the die images without subjecting the same to averaging processing to distinguish a random defect signal caused by a huge defect, or the like, and having an extremely high brightness from a repeated defect signal, and only extracts repeated defects with higher accuracy.


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