The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Mar. 21, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kevin L. Lin, Beaverton, OR (US);
Nicholas James Harold McKubre, Portland, OR (US);
Richard Farrington Vreeland, Portland, OR (US);
Sansaptak Dasgupta, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/525 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 23/5226 (2013.01); H01L 23/5329 (2013.01); H01L 23/53209 (2013.01); H01L 21/76852 (2013.01); H01L 23/5222 (2013.01); H01L 23/5256 (2013.01); H01L 28/10 (2013.01);
Abstract
Disclosed herein are integrated circuit (IC) components with dummy structures, as well as related methods and devices. For example, in some embodiments, an IC component may include a dummy structure in a metallization stack. The dummy structure may include a dummy material having a higher Young's modulus than an interlayer dielectric of the metallization stack.