The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Sep. 21, 2020
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Masihhur R. Laskar, Boise, ID (US);
Jeffery B. Hull, Boise, ID (US);
Hung-Wei Liu, Meridian, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/02 (2006.01); H10B 51/30 (2023.01);
U.S. Cl.
CPC ...
H01L 29/66553 (2013.01); H01L 21/02164 (2013.01); H01L 21/02282 (2013.01); H01L 21/02345 (2013.01); H01L 29/6684 (2013.01); H01L 29/66666 (2013.01); H01L 29/7827 (2013.01); H01L 29/78391 (2014.09); H10B 51/30 (2023.02);
Abstract
Integrated circuitry comprises an electronic component. Insulative silicon dioxide is adjacent the electronic component. The insulative silicon dioxide has at least one of (a) and (b), where: (a): an average concentration of elemental-form H of 0.002 to 0.5 atomic percent; and (b): an average concentration of elemental-form N of 0.005 to 0.3 atomic percent. Other embodiments, including method, are disclosed.