The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2023
Filed:
Sep. 29, 2017
Intel Corporation, Santa Clara, CA (US);
Bernd Waidhas, Pettendorf, DE;
Georg Seidemann, Landshut, DE;
Thomas Wagner, Regelsbach, DE;
Andreas Wolter, Regensburg, DE;
Andreas Augustin, Munich, DE;
Sonja Koller, Lappersdorf, DE;
Thomas Ort, Veitsbronn, DE;
Reinhard Mahnkopf, Oberhaching, DE;
Intel Corporation, Santa Clara, CA (US);
Abstract
A semiconductor package includes a first semiconductor die, a semiconductor device comprising a second semiconductor die, and one or more wire bond structures. The wire bond structure includes a bond interface portion. The wire bond structure is arranged next to the first semiconductor die. The first semiconductor die and the bond interface portion of the wire bond structure are arranged at the same side of the semiconductor device. An interface contact structure of the semiconductor device is electrically connected to the wire bond structure.