The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

May. 31, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Tin Poay Chuah, Bayan Lepas, MY;

Bok Eng Cheah, Bukit Gambir, MY;

Jackson Chung Peng Kong, Tanjung Tokong, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01R 12/77 (2011.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/147 (2013.01); H01R 12/77 (2013.01); H05K 1/028 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 3/361 (2013.01); H05K 2201/055 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/166 (2013.01);
Abstract

An electronic device and associated methods are disclosed. In one example, the electronic device includes a first rigid substrate, a second rigid substrate, a flexible substrate comprising a first portion attached to the first rigid substrate, a second portion attached to the second rigid substrate, a middle portion connecting the first portion to the second portion, wherein the middle portion is bent, and metallic traces therethrough, and a component forming a direct interface with the middle portion of the flexible substrate, the component electrically coupled to the metallic traces. In selected examples, the device further includes a casing.


Find Patent Forward Citations

Loading…