The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Apr. 15, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Hari Soundararajan, Sunnyvale, CA (US);

Shou-Sung Chang, Mountain View, CA (US);

Haosheng Wu, San Jose, CA (US);

Jianshe Tang, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/015 (2012.01); B24B 37/10 (2012.01); B24B 37/22 (2012.01); B24B 37/34 (2012.01); B24B 55/02 (2006.01); B24B 49/14 (2006.01); B24B 37/04 (2012.01); B24B 53/017 (2012.01);
U.S. Cl.
CPC ...
B24B 37/015 (2013.01); B24B 37/105 (2013.01); B24B 37/22 (2013.01); B24B 37/34 (2013.01); B24B 55/02 (2013.01); B24B 37/042 (2013.01); B24B 49/14 (2013.01); B24B 53/017 (2013.01);
Abstract

A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.


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