The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Apr. 14, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Kuo-Pi Tseng, Hsinchu, TW;

De-Fang Chen, Hsinchu, TW;

Chao-Cheng Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 29/66 (2006.01); H01L 21/3065 (2006.01); H01L 21/8234 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0924 (2013.01); H01L 21/3065 (2013.01); H01L 21/823418 (2013.01); H01L 21/823431 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01);
Abstract

A device includes a substrate, a channel layer, a gate structure, a source/drain epitaxial structure, and a bottom dielectric structure. The channel layer is over the substrate. The gate structure is over the substrate and surrounds the channel layer. The source/drain epitaxial structure is over the substrate and is connected to the channel layer. The bottom dielectric structure is between the source/drain epitaxial structure and the substrate.


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