The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Mar. 08, 2021
Applicants:

United Microelectronics Corp., Hsin-Chu, TW;

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, CN;

Inventors:

Li-Wei Feng, Kaohsiung, TW;

Yu-Hsiang Hung, Tainan, TW;

Ming-Te Wei, Changhua County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H10B 12/00 (2023.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H10B 12/0335 (2023.02); H10B 12/315 (2023.02); H10B 12/482 (2023.02); H01L 23/53257 (2013.01); H01L 23/53271 (2013.01); H10B 12/34 (2023.02);
Abstract

The present invention provides a semiconductor device, the semiconductor device includes a substrate, at least one bit line is disposed on the substrate, a rounding hard mask is disposed on the bit line, and the rounding hard mask defines a top portion and a bottom portion, and at least one storage node contact plug, located adjacent to the bit line, the storage node contact structure plug includes at least one conductive layer, from a cross-sectional view, the storage node contact plug defines a width Xand a width X. The width Xis aligned with the top portion of the rounding hard mask in a horizontal direction, and the width Xis aligned with the bottom portion of the rounding hard mask in the horizontal direction, Xis greater than or equal to X


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