The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Jul. 01, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yi-Chao Mao, Taoyuan, TW;

Chin-Chuan Chang, Hsinchu County, TW;

Szu-Wei Lu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6715 (2013.01); H01L 21/566 (2013.01); H01L 21/67126 (2013.01); H01L 21/6838 (2013.01); H01L 21/68735 (2013.01); H01L 24/09 (2013.01); H01L 2224/02371 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A system for thinning a substrate includes a chuck and a first liquid supply unit. The chuck includes a base portion and a frame portion disposed on the base portion, where the substrate is configured to be placed on a carrying surface of the chuck. The first liquid supply unit extends along sidewalls the frame portion and the base portion, an outlet of the first liquid supply unit is disposed next to the carrying surface of the chuck, the first liquid supply unit delivers a first liquid from a bottom of the chuck to the outlet, and the first liquid discharges from the outlet to cover a sidewall of the substrate.


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