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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11692269 B1

PDFFull Text
Date of Patent:
Jul. 04, 2023

Filed:

May. 26, 2020

Plasma processing apparatus

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hiroyuki Matsuura, Iwate, JP;

Kiyotaka Ishibashi, Yamanashi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Venjuris, P.C.

Primary Examiner:

Sylvia MacArthur

Assistant Examiner:

Michelle Crowell

Int. Cl.
CPC ...
C23C 16/00 (2006.01); C23C 16/50 (2006.01); H01J 37/32 (2006.01); H01L 21/673 (2006.01); C23C 16/458 (2006.01); C23C 16/34 (2006.01); C23C 16/44 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C23C 16/50 (2013.01); C23C 16/345 (2013.01); C23C 16/4408 (2013.01); C23C 16/4584 (2013.01); H01J 37/32082 (2013.01); H01J 37/32091 (2013.01); H01J 37/32458 (2013.01); H01J 37/32541 (2013.01); H01J 37/32715 (2013.01); H01L 21/67303 (2013.01); H01J 2237/3321 (2013.01); H01L 21/0217 (2013.01); H01L 21/02274 (2013.01);
Abstract

A plasma processing apparatus includes: a processing container having a cylindrical shape; a pair of plasma electrodes arranged along the longitudinal direction of the processing container while facing each other; and a radio-frequency power supply configured to supply a radio-frequency power to the pair of plasma electrodes. In the pair of plasma electrodes, an inter-electrode distance at a position distant from a power feed position to which the radio-frequency power is supplied is longer than an inter-electrode distance at the power feed position.

Find Patent Forward Citations

Matsuura, Hiroyuki. (2023). Plasma processing apparatus (U.S. Patent No. 11692269). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11692269

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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